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IBM Advances Chip Development - Self-Assembling

by Darren

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IBM has moved the field of computer chips ahead with their latest discovery. Of course, like most developments of this type, the new chip will run faster than any of its’ predecessors. The new chip uses an exotic material that “self-assembles” in a similar way to a seashell or snowflake.

The computer services and technology company said the new process allows the wiring on a chip to be insulated with vacuum, replacing the glass-like substances used for decades but which have become less effective as chips steadily shrink.

It is the latest achievement for IBM researchers, who have announced a number of advances in recent months allowing chips to get smaller despite challenges posed by physical laws at those tiny dimensions.

“This is one of the biggest breakthroughs I’ve seen in the last decade,” said John Kelly, International Business Machines Corp.’s (IBM.N: Quote, Profile, Research senior vice president of technology and intellectual property.

Impressive to say the least. Congrats to the team at IBM.

Reuters: Reuters

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